Tilmaamaha | |
Sifada | Qiimaha |
Soo saaraha: | Winbond |
Qaybta Alaabta: | AMA Flash |
RoHS: | Faahfaahin |
Habka Koritaanka: | SMD/SMT |
Xidhmada / Kiis: | SOIC-8 |
Taxane: | W25Q64JV |
Cabbirka xusuusta: | 64 Mbit |
Korontada sahayda - ugu yaraan: | 2.7 V |
Korontada sahayda - ugu badnaan: | 3.6 V |
Hadda Akhriska Firfircoon - Ugu badnaan: | 25 mA |
Nooca Interface: | SPI |
Inta ugu badan ee saacada: | 133 MHz |
Ururka: | 8 M x 8 |
Balaadhka Xogta Baska: | 8 xoogaa |
Nooca wakhtiga: | Isku mid ah |
Heerkulka Shaqaynta Ugu Yar: | - 40 C |
Heerkulka shaqada ee ugu badan: | + 85 C |
Baakad | saxaarad |
Summada: | Winbond |
Soo-dejinta hadda - ugu badnaan: | 25 mA |
Qoyaanka xasaasiga ah: | Haa |
Nooca Alaabta: | AMA Flash |
Tirada Xidhmada Warshada: | 630 |
Qayb-hoosaad: | Xusuusta & Kaydinta Xogta |
Magaca ganacsiga: | SpiFlash |
Culayska Cutubka: | 0.006349 oz |
Astaamaha:
* Qoyska cusub ee xusuusta SpiFlash - W25Q64JV: 64M-bit / 8M-byte
- Heerka SPI: CLK, /CS, DI, DO
- Dual SPI: CLK, /CS, IO0, IO1
- Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 - Software & Dib-u-dejin (1)
* Taxanaha Waxqabadka ugu sarreeya
- 133Mhz Single, Saacadaha Dual/Quad SPI
266/532Mhz u dhiganta Dual/Quad SPI
– Min.100K-Barnaamijka-Masixi wareegyada qayb kasta - In ka badan 20-sano oo xog haynta
* Akhris Joogta ah oo hufan
- Akhris joogto ah oo leh 8/16/32/64-Byte Wrap - Ilaa 8 saacadood si wax looga qabto xusuusta
- Oggolow XIP run ah (ku fulin meesha) hawlgalka - Wuxuu ka sarreeyaa X16 Isbarbardhigga Flash
* Awood hoose, Heerkul Balaadhan - Keliya sahayda 2.7 ilaa 3.6V
- <1μA Hoos-u-dhigis (nooca.)
-40°C ilaa +85°C baaxadda hawlgalka
* Dhisme dabacsan oo leh qaybo 4KB ah
- Qaybta lebbiska/Block Tirtiridda (4K/32K/64K-Byte) -Barnaamijka 1 ilaa 256 byte boggii barnaamijka la samayn karo
* Astaamaha Amniga Sare
– Software iyo Hardware-qorista-ilaaliya
- Ilaalinta gaarka ah ee OTP (1)
- Sare/Bottom, Kaabista ilaalinta diyaarinta - Ilaalinta diyaarinta diyaarinta shakhsi ahaaneed ee Block/Sector
- 64-Bit Aqoonsi Gaar ah oo qalab kasta ah
- Diiwangelinta Halbeegyada la ogaan karo (SFDP) - 3X256-Bytes Diiwaangelinta Amniga
- Qaybaha Diiwangelinta Xaalada Deggan & Aan Degenayn
* Baakadaha Waxtarka leh ee Booska
- 8-pin SOIC 208-mil / VSOP 208-mil
- 8-pad WSON 6x5-mm/8x6-mm, XSON 4x4-mm - 16-pin SOIC 300-mil
- 8-pin PDIP 300-mil
- 24-kubad TFBGA 8x6-mm (6x4 hannaan kubbadeed)
- 24-kubad TFBGA 8x6-mm (6x4/5x5 diyaarinta kubbadda)
- La xidhiidh Winbond KGD iyo xulashooyin kale