Daaweynta dusha PCB waa furaha iyo aasaaska tayada balastar SMT.Habka daawaynta ee isku xirkan inta badan waxaa ku jira qodobada soo socda.Maanta, waxaan kula wadaagi doonaa khibradda caddaynta guddiga wareegga wareegga:
(1) Marka laga reebo ENG, dhumucda lakabka dhejinta si cad looguma qeexin heerarka qaranka ee PC ee khuseeya.Waxa kaliya oo loo baahan yahay in la buuxiyo shuruudaha iibka.Shuruudaha guud ee warshaduhu waa sida soo socota.
OSP: 0.15 ~ 0.5 μm, ma cayimin IPC.Waxaa lagu talinayaa in la isticmaalo 0.3 ~ 0.4um
EING: Ni-3～5um;Au-0.05～0.20um (PC kaliya ayaa qeexaya shuruudaha ugu dhuuban hadda)
Im-Ag: 0.05 ~ 0.20um, dhumucdiisuna, way sii daran tahay daxalka (PC lama cayimin)
Im-Sn: ≥0.08um.Sababta dhumucdeedu waa in Sn iyo Cu ay sii wadi doonaan inay u koraan CuSn heerkulka qolka, taas oo saameynaysa iibinta.
HASL Sn63Pb37 guud ahaan waxa loo sameeyay si dabiici ah inta u dhaxaysa 1 iyo 25um.Way adag tahay in si sax ah loo xakameeyo habka.Leedh-ka xorta ah waxa ay isticmaashaa daawaha SnCu.Heerkulka habaynta sare ee sare awgeed, way fududahay in la sameeyo Cu3Sn oo leh codka liidata, oo si dhib yar loo isticmaalo hadda.
(2) Qoynta SAC387 (sida ku cad wakhtiga qoynta ee wakhtiyada kulaylka ee kala duwan, cutub: s).
0 jeer: im-sn (2) gabowga florida (1.2), osp (1.2) im-ag (3).
KULANKA PLENAR Zweiter Zweiter PLENAR Kalfadhi Im-Sn wuxuu leeyahay iska caabbinta daxalka ugu fiican, laakiin iska caabbinta alxanka ayaa aad u liidata!
4 jeer: ENG (3)-ImAg (4.3)-OSP (10) -ImSn (10).
(3) Qoynta SAC305 (ka dib marka la mariyo foornada laba jeer).
ENG (5.1)—Im-Ag (4.5)—Im-Sn (1.5)—OSP (0.3).
Dhab ahaantii, hiwaayadda ayaa laga yaabaa inay aad ugu jahwareersan yihiin cabbirradan xirfadlayaasha ah, laakiin waa in ay ogaadaan soosaarayaasha PCB-ga caddaynta iyo dhejinta.
Waqtiga boostada: Meey-28-2021
